Ship #1 Pending review

@Stylt on USB 2.0 Hub · about 6 hours ago

Project Summary: Custom USB 2.0 Hub
• What I designed:
Designed a custom 4-port USB 2.0 High-Speed hub using the CH334F controller, featuring a modern USB-C input and four classic USB-A outputs.
• What was challenging:
Routing the high-speed USB data lines. The data pairs were swapped, forcing me to drop down using vias to route underneath. This disrupted the signal skew, requiring precise tuning and length matching to correct it while maintaining the strict 90Ω differential impedance.
• What I'm proud of:
The clean PCB layout and the extensive GND via stitching, which ensures a rock-solid return path. I'm also proud of integrating essential hardware protections—like USBLC6 ESD protection, an overcurrent fuse, and per-port indicator LEDs—making the board highly robust and safe.

1 devlog
5h build

Video of Project → See source code →

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@Stylt on USB 2.0 Hub · about 7 hours ago

5h 7m logged

View this project on CADLAB.io.

usb2.0hub

🚀 USB 2.0 High-Speed Hub

This project is a custom-designed 4-port USB 2.0 hub built around the WCH CH334F controller. It is optimized for stable data transmission.

⚡ Core Specifications

Protocol: USB 2.0 High-Speed
Transfer Rate: Up to 480 Mbps
Controller IC: CH334F
Upstream Port: 1x USB [Type-C] (Connection to PC/Host)
Downstream Ports: 4x USB [Type-A] (Connection for peripherals)

🛡️ Protection & Diagnostics

💡 Status LEDs: Each downstream port features a dedicated indicator LED that lights up to confirm when a device is successfully connected.
⚡ ESD Protection: All USB data lines are equipped with USBLC6-2SC6 TVS diode arrays to safeguard against Electrostatic Discharge (ESD).
🔥 Overcurrent Protection: The power circuitry includes a built-in overcurrent fuse to protect the hub and connected peripherals from power surges or short circuits.

🛠️ PCB Design & Stackup

To ensure signal integrity and proper 90Ω differential impedance for the USB data lines, the board is designed as a 4-layer PCB.

Layer Stackup:

Top Layer: Signal (Main high-speed routing and components)
Inner Layer 1: GND Plane (Solid ground reference)
Inner Layer 2: Power Plane (Power distribution)
Bottom Layer: Second Signal (Low-speed routing and signal crossovers)

(When I was making the PCB I couldn’t timelapse it so I posted empty lapse. On estimate it took me about 5 hours)