FUSION 360!

(I did a lot in this one)

Sourcing 3D files

I needed the 3d models of all the different components as something to base myself off. I managed to find files for the 1.54” E-ink display, the SEEED XIAO ESP32-C6, the TP4056, and the 2 environment sensors - the SHT40 and the SGP40 on GrabCAD.

Modeling the enclosure

This was the time intensive part! I made it (hopefully) super easy to put together, with 3 main parts. There’s the front plate, back plate, and the main enclosure sandwiched in the middle of the two.
The front plate is secured to the e-ink and the main enclosure via 4 screws in the corners.

(see photo of the front plate)

The back plate is secured to the main enclosure via 4 screws in the corners that go into heatset inserts inserted in the main enclosure.

(see photo of the back plate)

(see photo of heatset insert holes)

Component positions!

The components aren’t randomly placed! The E-Ink display has to go at the front followed by the battery. Then there’s the 2 sensors either side of the enclosure. They are placed there next to grills to allow airflow and increase the accuracy of the readings. Then there’s the TP4056 charging module right at the back which will be glued down. It also has a big cutout in the backplate for the USB-C port. (the cutout is a lot bigger than the USB-C port itself as the TP4056 module might not be flush with the bottom of the enclosure so more space gives it more wiggle room.

(see photo with back plate and battery removed)

(see photo with front plate, E-Ink display and battery removed)

Where’s the microcontroller?!

The microcontroller (the SEEED XIAO ESP32-C6) doesn’t have any mounting holes and I can’t glue it down as I need to access the BAT+ and BAT- pads on the bottom. This means it will be freefloating within the enclosure which will help the ease of assembly and any debugging via its USB-C port.