It was time for the routing. I first tried an approach where the B.Cu layer was the ground pour. Afterwards while running the DRC, I found out actually the GND and VCC traces should be routed through the front layer for some reason. So what I did was flipping all the traces to the opposite layer of what they were, and put a copper island on F.Cu. But then I had the problem that VCC was blocking from making a proper ground pour… So I needed to remove a bunch of wires and wire everything the normal way.

In the end I added some decoration and…. The PCB is finished!