I have begun the layout of the pcb that will go inside the die. i will be using a flex pcb, so that I can fold it around the inside of the die, since I’m working everything in a 10x10 mm space. I’m hoping I can keep it that small, since some dice are smaller than others and I want to mostly keep the same internals for the different dice. I do still have to make a footprint for the supercapacitor I’m using (currently C3, but it’s not correct), which will go in the center.